Composite electronic component

ABSTRACT

A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims the benefit of priority toKorean Patent Application No. 10-2017-0168112 filed on Dec. 8, 2017 inthe Korean Intellectual Property Office, the entire disclosure of whichis incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a composite electronic component.

BACKGROUND

Recently, as electric vehicles have become prevalent, demand forresistance to electrostatic discharge (ESD) of electronic components andreliability in terms of resistance to an overcurrent due to ashort-circuit in case of failure has increased.

In order to improve resistance to ESD, it is necessary to preventinterlayer breakdown of internal electrodes when ESD is applied, forwhich an interlayer spacing of the internal electrodes of a multilayercapacitor may be adjusted to be increased.

Also, in order to address short-circuit defect, it is possible toincrease a long-directional margin of external electrode part wherecracks frequently occur due to external force so that a short-circuitbetween internal cracks may not occur even in the case that cracksoccur.

However, if the interlayer spacing between the internal electrodes isincreased or the margin between the internal electrode and an externalsurface is increased, capacitance, major characteristics of themultilayer capacitor, may be reduced.

In addition, when the multilayer capacitor is mounted on a board, abending crack may occur in the multilayer capacitor due to bending ofthe board.

Meanwhile, when the multilayer capacitor is mounted on a board, acousticnoise may be generated due to vibrations based on a piezoelectricphenomenon in terms of the characteristics of a dielectric.

SUMMARY

An aspect of the present disclosure may provide a composite electroniccomponent capable of enhancing ESD durability, preventing an overcurrentproblem and a bending crack due to a short-circuit in case of failure,and reducing acoustic noise, while reducing a reduction in capacitance.

According to an aspect of the present disclosure, a composite electroniccomponent may include: a multilayer capacitor including a capacitorbody, which includes and first and second internal electrodes facingeach other and a plurality of dielectric layers each interposedtherebetween, and first and second external electrodes disposed onopposing ends of the capacitor body; a high-rigidity chip including asubstrate disposed on a lower side of the multilayer capacitor and firstand second discharge electrodes disposed on the substrate and spacedapart from each other, the first and second discharge electrodes beingconnected to the first and second external electrodes, respectively, andextending to an upper or lower surface of the substrate; and an sealingpart covering the first and second discharge electrodes and including aspace portion, which is provided between the first and second dischargeportions.

The capacitor body may include first and second surfaces opposing eachother, third and fourth surfaces connected to the first and secondsurfaces and opposing each other, and fifth and sixth surfaces connectedto the first to fourth surfaces and opposing each other, each of thefirst and second internal electrodes may have one end exposed to thethird and fourth surfaces, and the first and second external electrodesmay include a first connection portion and a second connection portiondisposed on the third and fourth surfaces of the capacitor body,respectively, and a first band portion and a second band portionextending from the first and second connection portions, respectively,to portions of the first and second surfaces and portions of the fifthand sixth surfaces of the capacitor body, the first and secondconnection portions being connected to the first and second dischargeelectrodes, respectively.

The composite electronic component may further include: a first terminalelectrode covering portions of the first connection portion, the firstband portion disposed on the first surface of the capacitor body, oneend surface of the sealing part, and a portion of a lower surface of thesealing part; and a second terminal electrode covering portions of thesecond connection portion, the second band portion disposed on the firstsurface of the capacitor body, another end surface of the sealing part,and a portion of the lower surface of the sealing part.

The high-rigidity chip may be formed of alumina.

Portions of the first and second discharge portions may be disposed on alower surface of the substrate.

Portions of the first and second discharge portions may be disposed onan upper surface of the substrate.

The composite electronic component may further include an electrostaticdischarge (ESD) functional member disposed in the space portion andconnecting the first and second discharge portions.

Portions of the first and second discharge portions and the ESDfunctional member may be disposed on a lower surface of the substrate.

Portions of the first and second discharge portions and the ESDfunctional member may be disposed on an upper surface of the substrate.

A gap between the first and second discharge portions in the spaceportion may be 1 to 20 μm.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a transparent perspective view schematically illustrating acomposite electronic component according to a first exemplary embodimentin the present disclosure;

FIG. 2 is a cross-sectional view, taken along line 1-1′ of FIG. 1;

FIGS. 3A and 3B are plan views illustrating first and second internalelectrodes of FIG. 1, respectively;

FIG. 4 is a cross-sectional view schematically illustrating a compositeelectronic component according to a second exemplary embodiment in thepresent disclosure;

FIG. 5 is a transparent perspective view schematically illustrating acomposite electronic component according to a third exemplary embodimentin the present disclosure;

FIG. 6 is a cross-sectional view, taken along line II-II′ of FIG. 5;

FIG. 7 is a cross-sectional view schematically illustrating a compositeelectronic component according to a fourth exemplary embodiment in thepresent disclosure;

FIG. 8 is a graph illustrating comparison between acoustic noise of therelated art composite electronic component and a composite electroniccomponent of the present exemplary embodiment;

FIGS. 9 and 10 are photographs illustrating results of bending strengthtest of the related art composite electronic component; and

FIGS. 11 and 12 are photographs illustrating results of bending strengthtest of the composite electronic component of the present exemplaryembodiment.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure will now be described indetail with reference to the accompanying drawings.

FIG. 1 is a transparent perspective view schematically illustrating acomposite electronic component according to a first exemplary embodimentin the present disclosure, FIG. 2 is a cross-sectional view, taken alongline 1-1′ of FIG. 1, and FIGS. 3A and 3B are plan views illustratingfirst and second internal electrodes of FIG. 1, respectively.

Hereinafter, preferred exemplary embodiments in the present disclosurewill be described with reference to the accompanying drawings.

Here, X, Y, and Z in the drawings are defined as a length direction, awidth direction, and a thickness direction of a capacitor body,respectively. Further, the thickness direction may be used as having thesame concept as a stacking direction of dielectric layers.

Referring to FIGS. 1 through 3, a composite electronic componentaccording to a first exemplary embodiment in the present disclosureincludes a multilayer capacitor 100, a high-rigidity chip 200, and anencapsulating part 180.

The multilayer capacitor 100 includes a capacitor body 110 and first andsecond external electrodes 131 and 132.

The capacitor body 110 includes a plurality of dielectric layers 111 andfirst and second internal electrodes 121 and 122 stacked to face eachother with the dielectric layer 111 interposed therebetween.

In one exemplary embodiment in the present disclosure, a shape of thecapacitor body 110 is not limited but may be a hexahedral shape asillustrated.

The capacitor body 110 includes first and second surfaces opposing eachother in the Z direction, third and fourth surfaces connected to thefirst and second surfaces and opposing each other in the X direction,and fifth and sixth surfaces connected to first and second surfaces,connected to the third and fourth surfaces, and opposing each other inthe Y direction. Here, the first surface, a lower surface of thecapacitor body 110, may be a surface facing a mounting direction.

The plurality of dielectric layers 111 constituting the capacitor body110 are in a sintered state and adjacent dielectric layers 111 may beintegrated such that boundaries therebetween may not be readilyapparent.

The dielectric layer 111 may be formed by sintering a ceramic greensheet including ceramic powder, an organic solvent, and an organicbinder.

The ceramic powder, a material having a high dielectric constant, may beformed of a barium titanate (BaTiO₃)-based material, a strontiumtitanate (SrTiO₃)-based material, and the like, but is not limitedthereto.

One ends of the first and second internal electrodes 121 and 122 may beexposed to the third and fourth surfaces of the capacitor body 110,respectively.

The first and second internal electrodes 121 and 122 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be, but is not limited to, nickel (Ni), copper(Cu), palladium (Pd), or an alloy thereof.

The first and second internal electrodes 121 and 122 may be formed byprinting conductive paste on the ceramic green sheet forming thedielectric layer 111 through a printing method such as a screen printingmethod or a gravure printing method. The capacitor body 110 may beformed by alternately laminating the ceramic green sheets with theinternal electrodes printed thereon and sintering the same.

The first and second external electrodes 131 and 132 are disposed atopposing ends of the capacitor body 110 in the X direction.

The first and second external electrodes 131 and 132 include first andsecond connection portions 131 a and 132 a disposed on the third andfourth surfaces of the capacitor body 110 and first and second bandportions 131 b and 132 b extending from the first and second connectionportions 131 a and 132 a to portions of the first and second surfaces ofthe capacitor body 110, respectively.

The first and second band portions 131 b and 132 b may further extend toportions of the fifth and sixth surfaces of the capacitor body 110.

The high-rigidity chip 200 includes a substrate 150 and first and seconddischarge electrodes 161 and 162 disposed on a lower side of themultilayer capacitor 100.

Hereinafter, for the purposes of description, in the followingdescriptions of the exemplary embodiment in the present disclosure,surfaces of the high-rigidity chip 200 and an sealing part facing in thesame directions as those of the six surfaces of the capacitor body 110,respectively, are defined as the same surfaces.

The substrate 150 may be formed of a highly rigid material, for example,alumina (Al₂O₃).

Here, a length and width of the substrate 150 may be smaller than alength and width of the multilayer capacitor 100 by 0.1 to 0.3 mm, and athickness of the substrate 150 may be 0.05 to 0.15 mm.

The first and second discharge electrodes 161 and 162 include first andsecond connection portions 161 a and 162 a and first and seconddischarge portions 161 b and 162 b, respectively.

The first and second connection portions 161 a and 162 a may coveropposing ends of the substrate 150 in the X direction and may beelectrically connected to the first and second band portions 131 b and132 b on a lower side of the first and second external electrodes 131and 132, respectively.

Here, the first and second connection portions 161 a and 162 a and thefirst and second band portions 131 b and 132 b may be adhered using aconductive adhesive, a conductive resin, or the like.

The first and second discharge portions 161 b and 162 b are portionsextending from the first and second connection portions 161 a and 162 ato an upper surface or a lower surface of the substrate 150,respectively, and are formed to be spaced apart from each other in the Xdirection.

The first and second discharge portions 161 b and 162 b may be arrangedto face each other in the X direction on the same plane. In thisexemplary embodiment, it is illustrated that the first and seconddischarge portions 161 b and 162 b are disposed on the lower surface ofthe substrate 150.

Here, a space portion 170 provided between the first and seconddischarge portions 161 b and 162 b (to be described later) serves tobypass ESD.

A gap between the first and second discharge portions 161 b and 162 b inthe space portion 170 serves to determine an ESD turn-on voltage and maybe 1 to 20 μm. Here, the turn-on voltage refers to a voltage by whichhigh-voltage static electricity flows to a lead electrode due to ESD.

In case where a current having a high voltage flows in an electroniccomponent (i.e., capacitor) but it does not flow to a lead electrode, adegree to which the capacitor withstands ESD applied thereto is relatedto a distance between internal electrodes of the capacitor. Here, if theESD voltage that the capacitor withstands is lower than a turn-onvoltage of the first and second discharge portions 161 b and 162 b,damages such as cracks may occur in the capacitor.

The first and second discharge electrodes 161 and 162 may be formed of aconductive paste containing a conductive metal.

The conductive metal may include at least one of copper (Cu), silver(Ag), palladium (Pd), tin (Sn), nickel (Ni), and gold (Au), or acompound thereof but is not limited thereto.

The first and second discharge electrodes 161 and 162 may be formed onthe substrate 150 using a laser scribing apparatus.

Meanwhile, although not shown, a nickel/tin (Ni/Sn) plating layer may befurther formed on the outside of the first and second dischargeelectrodes 161 and 162 through plating.

The sealing part 180 covers the first and second discharge electrodes161 and 162 and the space portion 170 separating the first and seconddischarge portions 161 b and 162 b from each other is positionedtherein.

The sealing part 180 serves to protect the high-rigidity chip 200including the substrate 150 and the first and second dischargeelectrodes 161 and 162 from an external environment.

The sealing part 180 may include, for example, an epoxy resin as aninsulating material, and the material thereof is not limited.

The composite electronic component of the present exemplary embodimentmay further include first and second terminal electrodes 141 and 142.

The first terminal electrode 141 may cover portions of the firstconnection portion 131 a and the first band portion 131 b of the firstexternal electrode 131 disposed on the second surface of the capacitorbody 110 and one end surface and a portion of a lower surface of thesealing part 180. That is, the first terminal electrode 141 may coverone lower corner of the sealing part 180.

The second terminal electrode 142 may cover portions of the secondconnection portion 132 a and the second band portion 132 b of the secondexternal electrode 132 disposed on the second surface of the capacitorbody 110 and the other end surface and a portion of the lower surface ofthe sealing part 180. That is, the second terminal electrode 142 maycover the other lower corner of the sealing part 180.

The first and second terminal electrodes 141 and 142 may be formed of aconductive paste containing a conductive metal.

The conductive metal may be, but is not limited to, nickel (Ni), copper(Cu), tin (Sn), or an alloy thereof.

The first and second terminal electrodes 141 and 142 may be formed bydipping, but any other method such as plating may also be used.

Also, although not shown, a nickel/tin (Ni/Sn) plating layer based onplating may further be disposed on the outside of the first and secondterminal electrodes 141 and 142.

Referring to FIG. 4, the first and second discharge portions 161 b and162 b of the first and second discharge electrodes 161 and 162 extendfrom the first and second connection portions 161 a and 162 a to anupper surface of the substrate 150, and a space portion 170′ isconnected to the first and second discharge portions 161 b and 162 b onthe upper surface of the substrate 150.

Meanwhile, according to another exemplary embodiment in the presentdisclosure, ESD functional member 190 may be disposed in the spaceportion to connect the first and second discharge portions 161 b and 162b.

The ESD functional member 190 may serve to enhance ESD durability andadjust an ESD turn-on voltage. The ESD functional member may be an ESDsuppressor but is not limited thereto.

The ESD functional member 190 may include, but is not limited to, aconductive polymer. When a signal voltage input from a signal interfacethrough which a signal is transmitted to a system or an IC from aconnector, an IC block of a power supply terminal, or a communicationline is at a rated voltage (circuit voltage) level, the conductivepolymer has properties of a non-conductor, but when an overvoltage suchESD occurs instantaneously, the conductive polymer has properties of aconductor.

When an overvoltage such as ESD occurs, the first and second dischargeportions 161 b and 162 b may be short-circuited to each other due to theESD functional member 190 having the properties of a conductor.Referring to FIGS. 5 and 6, the first and second discharge portions 161b and 162 b may be arranged on the lower surface of the substrate 150and the ESD functional member 190 may be connected to the first andsecond discharge portions 161 b and 162 b on the lower surface of thesubstrate 150.

Referring to FIG. 7, the first and second discharge portions 161 b and162 b may be formed on an upper surface of the substrate 150 and the ESDfunctional member 190′ may be arranged to be connected to the first andsecond discharge portions 161 b and 162 b on the upper surface of thesubstrate 150.

The multilayer capacitor is an open circuit in direct current (DC) powersupply. However, when a crack occurs in the capacitor body due to anexternal environment, the internal electrodes may overlap each other ora current path may occur to cause failure due to a short-circuit.

Failure due to a short-circuit causes an overcurrent to flow to anundesired line to negatively affect other components. In the relatedart, it is designed such that a margin of the external electrode, whichare liable to be cracked by an external force, is increased so that ashort-circuit may not occur between both electrodes of the internalelectrodes although a crack occurs. In this case, however, the increasein the margin relatively reduces an area of the internal electrodesrealizing capacitance. According to the present disclosure, thehigh-rigidity chip having the discharge electrodes is attached to thelower surface of the multilayer capacitor to provide an ESD suppressorserving to bypass ESD, whereby an ESD protection function may berealized without changing the design of the internal electrodes of themultilayer capacitor.

Table 1 shows the results of testing, at 25 kV, ESD durability of 10samples having the conventional MLCC structure without a high-rigiditychip according to a comparative example. Table 2 shows the results oftesting, at 25 kV, ESD durability of 10 composite electronic componentsof the present disclosure according to an inventive example. Here, allthe MLCCs having a length and a width of 16*8 mm were used. Here, #1 to#10 (“comparative example 1”) and #21 to #30 (“inventive example 1”) are1 nF products and #11 to #20 (“comparative example 2”) and #31 to #40(“inventive example 2”) are 10 nF products.

TABLE 1 Before After test test # IR (Ω) IR (Ω) 1 4.14E*10 Short occurs 26.53E*10 9.15E*10 3 8.59E*10 3.47E*10 4 3.43E*10 Short occurs 5 3.28E*103.16E*10 6 6.05E*10 Short occurs 7 5.37E*10 2.72E*10 8 3.09E*10 Shortoccurs 9 3.52E*10 5.41E*10 10 3.11E*10 Short occurs 11 1.32E*10 Shortoccurs 12 2.07E*10 Short occurs 13 1.63E*10 Short occurs 14 6.17E*10Short occurs 15 1.58E*10 Short occurs 16 1.95E*10 Short occurs 171.35E*10 Short occurs 18 1.22E*10 Short occurs 19 8.48E*10 Short occurs20 1.34E*10 Short occurs

TABLE 2 Before After test test # IR (Ω) IR (Ω) 21 3.95E*10 1.16E*10 224.14E*10 7.15E*10 23 5.13E*10 9.53E*10 24 5.43E*10 1.73E*10 25 2.95E*107.59E*10 26 2.97E*10 7.67E*10 27 2.63E*10 1.05E*10 28 2.80E*10 1.09E*1029 2.97E*10 1.39E*10 30 2.49E*10 1.29E*10 31 6.41E*10 1.76E*10 322.08E*10 1.69E*10 33 6.47E*10 1.40E*10 34 2.24E*10 1.44E*10 35 2.08E*101.45E*10 36 3.51E*10 1.74E*10 37 8.71E*10 1.67E*10 38 2.24E*10 1.58E*1039 2.40E*10 1.69E*10 40 6.19E*10 1.88E*10

Referring to Table 1 and Table 2, in the case of the comparativeexample, IR was decreased after the test and short-circuit occurred inmany cases. In the case of the inventive example, IR before and afterthe test was good in all the samples. That is, according to the presentexemplary embodiment, the effect of improving ESD durability andpreventing the short-circuit may be expected.

In a state in which the composite electronic component is mounted on aboard, when voltages having the opposite polarities are applied toterminals formed on opposing sides of the composite electronic componentin the length direction, the capacitor body expands and contracts in thethickness direction Z due to an inverse piezoelectric effect of thedielectric layer and opposing side portions of the terminals contractand expand, opposite to expansion and contraction of the capacity bodyin the thickness direction, due to a Poisson effect.

Here, since the composite electronic component according to an exemplaryembodiment in the present disclosure includes the high-rigidity chipdisposed on the lower surface of the capacitor body, the high-rigiditychip reduces stress transmitted from the multilayer capacitor to theboard, reducing transmission of vibrations to the board due to inversepiezoelectric properties of the capacitor body when the compositeelectronic component is mounted on the board, resulting in a reductionin acoustic noise.

Referring to FIG. 8, it can be seen that the composite electroniccomponent of the present exemplary embodiment has an acoustic noisereduction effect of 12 to 13 dB, compared to the electronic component ofthe comparative example which does not include a high-rigidity chip.Comparative example 1 and inventive example 1 represent a 1 nF model,and comparative example 2 and inventive example 2 represent a 10 nFmodel.

Also, according to the present disclosure, since the high-rigidity chipdisposed on the lower surface of the multilayer capacitor preventsoccurrence of a bending crack of the multilayer capacitor due to bendingof the board when the multilayer capacitor is mounted on the board, thusrealizing an open failure mode.

In this test, a bending strength test was carried out on each of thecomparative example and the inventive example using 20 MLCCs of 1005size under conditions of 15 mm and 10 sec, respectively. In thecomparative example, cracks and short-circuits occurred in all the 20samples as illustrated in FIGS. 9 and 10, and in the case of theinventive example, solder of an alumina chip portion fell out to causean open defect only in 6 samples out of 20 samples as illustrated inFIGS. 11 and 12, while no cracks, short defects, and open defectsoccurred in the remaining 14 samples of the inventive example.

Meanwhile, if an interlayer thickness of the internal electrode isincreased, a distance in the denominator of the dielectric constantformula increases to decrease capacitance, while if the margin in the Xdirection is increased, the area of the internal electrodes decreases toreduce an area of the numerator of the dielectric constant formula todecrease capacitance.

In the case of the present exemplary embodiment, it is not necessary toincrease the interlayer thickness of the internal electrode or toincrease the margin of the external electrode portion in the Xdirection, and thus, the reduction of the capacitance of the electroniccomponent may be minimized.

As set forth above, according to exemplary embodiments of the presentdisclosure, since the high-rigidity chip including the dischargeelectrodes serving to by bypass ESD is attached to the lower part of themultilayer capacitor, the interlayer thickness of the internal electrodeis not required to be increased or the margin of the external electrodepart in the longer direction is not required to be increased, and thus,ESD durability may be enhanced, while the reduction in the capacitanceis minimized, and an overcurrent due to a short-circuit in the event ofa defect and a bending crack may be prevented to ensure high reliabilityand reduce acoustic noise as well.

While exemplary embodiments have been illustrated and described above,it will be apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

1. A composite electronic component comprising: a multilayer capacitorincluding a capacitor body, which includes first and second internalelectrodes facing each other and a plurality of dielectric layers eachinterposed therebetween, and first and second external electrodesdisposed on opposing ends of the capacitor body; a high-rigidity chipincluding a substrate disposed on a lower side of the multilayercapacitor and first and second discharge electrodes disposed on thesubstrate and spaced apart from each other, the first and seconddischarge electrodes being connected to the first and second externalelectrodes, respectively, and extending to both side and upper surfacesof the substrate or extending to both side and lower surfaces of thesubstrate; a sealing part covering the first and second dischargeelectrodes and including a space portion, which is provided between thefirst and second discharge electrodes; and first and second terminalelectrodes disposed on an exterior side of the multilayer capacitor andthe high-rigidity chip, wherein the first and second dischargeelectrodes are spaced apart from the first and second terminalelectrodes, respectively.
 2. The composite electronic component of claim1, wherein the capacitor body includes first and second surfacesopposing each other, third and fourth surfaces connected to the firstand second surfaces and opposing each other, and fifth and sixthsurfaces connected to the first to fourth surfaces and opposing eachother, each of the first and second internal electrodes has one endexposed to the third and fourth surfaces, respectively, and the firstand second external electrodes include a first connection portion and asecond connection portion disposed on the third and fourth surfaces ofthe capacitor body, respectively, and a first band portion and a secondband portion extending from the first and second connection portions,respectively, to portions of the first and second surfaces and portionsof the fifth and sixth surfaces of the capacitor body, the first andsecond connection portions being connected to the first and seconddischarge electrodes, respectively.
 3. The composite electroniccomponent of claim 2, wherein the first terminal electrode coversportions of the first connection portion, the first band portiondisposed on the first surface of the capacitor body, one end surface ofthe sealing part, and a portion of a lower surface of the sealing part;and the second terminal electrode covers portions of the secondconnection portion, the second band portion disposed on the firstsurface of the capacitor body, another end surface of the sealing part,and a portion of the lower surface of the sealing part.
 4. The compositeelectronic component of claim 1, wherein the high-rigidity chip isformed of alumina.
 5. The composite electronic component of claim 1,wherein portions of the first and second discharge electrodes aredisposed on a lower surface of the substrate.
 6. The compositeelectronic component of claim 1, wherein portions of the first andsecond discharge electrodes are disposed on an upper surface of thesubstrate.
 7. The composite electronic component of claim 1, furthercomprising: an electrostatic discharge (ESD) functional member disposedin the space portion and connecting the first and second dischargeelectrodes.
 8. The composite electronic component of claim 7, whereinportions of the first and second discharge electrodes and the ESDfunctional member are disposed on a lower surface of the substrate. 9.The composite electronic component of claim 7, wherein portions of thefirst and second discharge electrodes and the ESD functional member aredisposed on an upper surface of the substrate.
 10. The compositeelectronic component of claim 1, wherein a gap between the first andsecond discharge electrodes in the space portion is 1 to 20 μm.
 11. TheComposite electronic component of claim 1, wherein the sealing part isarranged between the first discharge electrode and the first terminalelectrode, and between the second discharge electrode and the secondterminal electrode.